EVG 520IS For Sale

Model Year:	2011
Quantity:	1
Condition:	New
Serial No:	Available upon request
Availability:	SOLD

Configuration:

EVG520IS Semi-automated Wafer Bonding System
Suitable for up to 200mm wafers
Configured with 1 bond module, manual handling

Confgured as follows:

• PC controlled OS
• MS-Windows® based process software for recipes, processing and diagnostics
• Automated recording of process parameters

Bond module with 200mm heaters
• Standard bond chamber with top- and bottom side heaters
• Flag pulling mechanism
• Up to 550°C and 10kN
• Atmospheric capabilities down to 1 x 10-3 mbar (7.5 x 10 -4 Torr)
• 3 bar abs. pressure
• Separate connections for evacuation and vent
• Independent temperature controllers for top and bottom side
• Electronic pressure regulator for controlled contact force
• Pneumatic wafer bow pin
  - For most accurate alignment of separated wafers
  - Spring-loaded pin in bond chamber
• Rapid Cooling:
  - for Bottom Side Heater
  - for Top Side Heater
  - For simultaneous top/bottom side cooling
  - Forced water cooling
  - Silent operation
  - Programmable cooling rate
  - Secure fluidic path without seals in vacuum
  - Requires closed loop cooling water supply according to EVG Spec.

Vacuum:
• Turbo molecular pump with control unit
• Pump time < 2min from 1000 to 1 x 10-3 mbar

Anodic Bonding package:
• Bond monitor for continuous display of bond parameters
• High resolution display of the bond current Resolution 20 μA.
• High voltage power supply 2000 V/50 mA
• Wait command for current value and/or charge
 

Comments:

This wafer bonder is a brand new unit. It was installed recently and has run less than 100 wafers.   It is being offered at an attractive price.  Please contact us for pricing and additional details.