EVG 6200∞ For Sale

Model Year:	2011
Quantity:	1
Condition:	New
Serial No:	Available upon request
Availability:	SOLD

Configuration:

EVG6200∞ Infinity Semi-automated Bond Alignment System
Suitable for up to 200mm wafers
Configured with 1 bond alignment module, manual handling

Wafer-to-wafer aligner for subsequent wafer bonding applications of up to 200 mm.

General
• Software adjustable wafer separation distance 0 - 300μm
• Wafer thickness 0.1 - 4.4 mm with a total stack of thickness of 4.5 mm (extended thickness range optional)
• Semi automatic loading with mechanical prealignment
• Quick change of chuck with automatic pressure and vacuum transfer
• NRTL listing mark, conforms to UL STD 61010A-1
• One storage rack for up to 5 aligner tools
• EC Declaration of conformity (certification done by EVG)
• PC controlled operating environment
• Solid State Drive and Hard Drive - for high availability and reliability Software
• MS-Windows® based process software for recipes,processing and diagnostics
• Automated recording of process parameters
• Storage of files and presets on hard disk or network
• Password protected access levels for operator, engineer, and maintenance

Software for bond alignment
• Recipe parameters and user guidance for bond alignment processes
• Optical alignment of 2 wafers (after manual loading) for Silicon Direct Bonding (SDB) or other substrate configurations like Si+Glass, Si+Si
• For subsequent anodic, thermo-compression or fusion bonding processes in a EVG500 series bond system

Alignment stage fully motorized
• Fully motorized X, Y, Theta and Z alignment stage, alignment via 3 axis joystick.
• With DC motor controllers for cursor key fine alignment
• Automatic wedge compensation system designed for optimized print gap control
• WEC contact force from 0.5 - 40 N adjustable

Bottom side microscope
• Motorized splitfield microscopes for alignment in visible light with high resolution CCD-cameras
• Bottom side alignment via digitized alignment keys (mask) or cross hair
Travel range*: X: 78 (58)mm-180mm; Y: ± 12mm
• Digital Zoom software providing 2x and 4x image magnification for fine alignment with objectives
Objective 10x, qty 2 (3.6x - 20x available)
*actual travel range might be restricted by chuck design

Objective 3.6x (qty 2)

Bond chucks, qty 2,  200mm for mechanically aligned bonding
• For optically alignment of glass window wafers and interposers.
• Allows wafer contact in vacuum and defined atmosphere with configured EVG500 Series bonding system.
• No metal ion contamination
• Separation flags
• Tooling design to be compatible with TI wafer design
• All wafer contact surfaces to be Teflon
• silicon nitride designed tooling for glass frit bonding
• intermediate graphite piece for corning anodic bonding

Bond tool sets, 2 qty, 200mm for edge handling
• For optically aligned bonding in combination with an EVG bond aligner
• Allows wafer contact in vacuum and defined atmosphere with configured EVG500 Series bonding system.
• No metal contamination.
• Separation flags
• Edge handling configuration
• Consists of 1 Loading cuck + 2 bond chucks + loading frame
• All contact surfaces are Teflon to prevent scratching of the glass wafers
• silicon nitride designed tooling for glass frit bonding
• intermediate graphite piece for anodic bonding

Rack unit for EVG6200 Bond Aligner
• Integrates EVG6200 system, operating elements and monitor
• Vibration isolated
• Prepared for robotic autoload system (Motorized Alignment Stage neefed)

Comments:

This bond aligner is a brand new unit. It was installed recently and has run less than 100 wafers. It is being offered at an attractive price. Please contact us for pricing and additional details.