KARL SUSS FC150 (SRA) Flip Chip Bonder For Sale

Model Year:	2002
Quantity:	1
Condition:	Good operational condition
Serial No:	Available upon request
Availability:	SOLD

Configuration:

• Year of manufacture: 2002
  
• High precision solder reflow arm
• Chip heating system
• 2" heating chuck, low force
• 2" heating tool with pedestal, <2mm
• 2" heating tool with pedestal, >2mm
• Gas confining cover
• High resolution XY-stage
• Large travel theta-Z stage
• Advanced laser leveling system
• Accurate fluid dispense
• Cognex vision system

 

More details available upon request.

Comments:

This bonder was used for R&D only. Deinstalled in June 2010.  It is available for inspection at our facility in Blackwood, NJ USA.

Installation and training available worldwide at additional cost. All services performed by very senior technicians with many years of OEM experience working on FC150 systems.