KARL SUSS FC150 (SRA) Flip Chip Bonder For Sale

Model Year:	2001
Quantity:	1
Condition:	Good operational condition
Serial No:	Available upon request
Availability:	SOLD

Configuration:

Karl Suss FC150 Flip Chip Bonder

Configured as follows:
High Precision Solder Reflow arm (SRA)
2" Heating, Low force Chuck
High Resolution X-Y stage (+/-5um)
Theta Stage( +/-7 deg)
Advanced Laser Leveling System
Automatic Alignment (Cognex 8000)
Process Recording
upto 450deg C heating
 

Comments:

In Feb 2011, the system was taken out of production. It is in excellent operational condition.

Installation and training available worldwide at additional cost. All services performed by very senior technicians with many years of OEM experience working on FC150 systems.