KARL SUSS FC150 (UBA+SRA) Flip Chip Bonder For Sale

Model Year:	1996
Quantity:	1
Condition:	Good operational condition
Serial No:	Available upon request
Availability:	SOLD

Configuration:

• Year of manufacture: 1996
• Fully Refurbished by OEM in year 2004
• Configured as follows:
• UBA (50Kg)- Universal Bonding Arm
• SRA - Solder Reflow Arm
• 6” Lower chuck
• 2” Standard heating system upper chuck
• Auto Align
• Mass reflow confinement cover.
• Windows Operating System

Comments:

This system was originally manufactured in 1996.  Then refurbished by OEM in 2004.  It was used as a development tool as well as low volume production tool.

In June 2010, the system was deinstalled and packed per OEM recommendation with all recommended shipping fixtures.  It is available for inspection at our facility in Blackwood, NJ USA.

Installation and training available worldwide at additional cost.  All services performed by very senior technicians with many years of OEM experience working on FC150 systems.